NIDEC 3D BUMP INSPECTION SYSTEM 3D 錫球檢查機
Capable of implementing next generation IC Substrate 3D Bump inspection.
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產品特色
- 3D (Height) & 2D (Diameter) simultaneous inspection. (uBump, Round, Flattened)
- Laser Triangulation method for 3D measurement.
- Highest Throughput, Highest Accuracy.
- Optimized Interface, Increased Usability.
- Apply to FC-BGA, FC-CSP & Panel.
產品資訊
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原廠名稱
NIDEC -
製程名稱
測試/檢查/品管篇 -
英文名稱
3D BUMP INSPECTION SYSTEM -
產品細目
檢查機
