Hirata 自動晶圓傳輸機 EFEM
晶圓廠設備自動化整合服務的提供，可搭配不同晶圓尺寸的設備前端自動化模組
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產品特色
- Minimum Footprint: Enables the flexible arrangement of robots, load ports and hands.
- High Throughput: Smooth and High Speed wafer handling with AC servo system and control.
- Strongly-built slider: Robust rack & pinion ensures quiet driving and lubrication-free.
- Meets Customer's Requirement with Various Options
- Particle Free: Proven Clean FOUP Opener, Smooth down air flow Enclosure & High Clean Robot.
產品資訊
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原廠名稱
平田 -
製程名稱
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
英文名稱
EFEM -
產品細目
晶圓自動傳輸機
