SIKAMA Reflow Oven Falcon 8500
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機能・特性
- The maximum temperature up to 400℃ and temperature uniformity ±2℃
- The maximum substrate capacity dimensions: 8(L)x11(W) INCH
- Equipment Spec.: A. Wafer size: 8 inches / B. Dimensions (LxDxH, cm): 251x61x117
製品情報
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MANUFACTURER
SIKAMA -
MANUFACTURING PROCESS
WLCSP/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping -
Details
8 inches Reflow Oven
