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SIKAMA Desktop Reflow Oven FALCON 5C

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Features
  • The maximum temperature up to 400℃ and temperature uniformity ±2℃
  • The maximum substrate capacity dimensions: 5(L)x5.75(W) INCH
  • Equipment Dimensions (LxDxH, cm): 135x64x66
Product Information
  • MANUFACTURER
    SIKAMA
  • MANUFACTURING PROCESS
    WLCSP/BGA/Ceramic e-WLB(Fan out)/Flip Chip/Wafer Bumping
  • Details
    It can handle fluxless gold tin reflow, singulated ball reflow of BGA’s, fixtured double-sided boards, large microwave components, and various substrate materials.
BUSINESS CONTACTS

If you have further needs, please contact us, we have a professional staff will serve you.

  • CONTACT
    Yarny Lin
    • Tel : 03-5530377 ext.103
    • Mail : Yarny_Lin@tkk.com.tw
  • CONTACT
    Joyce Peng
    • Tel : 03-5530377 ext.103
    • Mail : Joyce_Peng@tkk.com.tw
  • CONTACT
    Criss Wu
    • Tel : 03-5530377 ext.104
    • Mail : Criss_Wu@tkk.com.tw